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      1. EEPROM

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        With the aid of leading 130nm-shrink process platform, Puya developed competitive die size, high performance & high reliability EEPROM products, which are widely used in STB, network devices, communications, mobile phone, IP-Camera, smart meter, automotive, etc.


        IIC EEPROM

        After six years of development, Puya has formed an abundant product lineup of IIC EEPROM, with different capacities  and form factors. The highlight of Puya IIC EEPROM is its super long data retention property,which can reach 200 years.



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        Wafer-Level Chip Scale Package(WLCSP)

        Wafer-Level Chips Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options.The die size of Puya products has leading competitiveness,so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash,IIC EEPROM&VCN Driver products for mobile or portable form factor applications, such as 3D-CCM,digital cameras,smart watches,GPS navigation device,etc.

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