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      1. IIC EEPROM

        您現在的位置:首頁 > 產品中心 > EEPROM > IIC EEPROM

        Puya designs & offers industrial level series, ultra-high reliability series and automotive series IIC EEPROM, with the densities ranging from 2Kb to 1024Kb. Based on the excellent quality and outstanding customer service, Puya IIC EEPROM product line has been approved by numerous electronics customers.


        Features

         Up to 4M cycling and 200 year data retention
         6000V HBM /  200mA 125C Latch-up capability
         0.5uA standby current / 1.5mA program current
         3ms write time/  1.7V 1MHz bus frequency
         Safety protection for  power  on-off / Anti-noise IO design
         ID page for customer encryption
         100% room temperature and high temperature CP
         Full series SOP/TSSOP/UDFN support / 2K-256K SOT23 support
         Known Good Die (KGD) support
         Wafer-Level Chip Scale Package (WLCSP) support


        Industrial Level Series

        • 2Kb
        • 4Kb
        • 8Kb
        • 16Kb
        • 32Kb
        • 64Kb
        • 128Kb
        • 256Kb
        • 512Kb
        • 1Mb
            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C02A-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C04C-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN / MSOP8 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C08C-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN / MSOP8 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C16C-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN / MSOP8 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C32C-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C64C-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C128D-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          O

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead / SOT23 5 PIN /
          TSOT23 5 PIN

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C256B-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C512B-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24CM01B-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          100Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead

        Ultra-high Reliability Serials

        • 256Kb
        • 512Kb
            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C256-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          200Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead

            Part No. Max CLK Vcc Temp. I/O Bus Data
            Retention
            UID Status Package Datasheet
        • P24C512-MI

          1MHz

          1.7~5.5V

          -40~85℃

          /

          200Y

          -

          Mass Production

          SOP 150mil / TSSOP 8-lead /
          DFN(2X3) / UDFN(2X3) /
          DIP 8-lead


        Related Products

        Known Good Die(KGD)

        Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....

        更多詳細>>

        Wafer-Level Chip Scale Package(WLCSP)

        Wafer-Level Chips Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options.The die size of Puya products has leading competitiveness,so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash,IIC EEPROM&VCN Driver products for mobile or portable form factor applications, such as 3D-CCM,digital cameras,smart watches,GPS navigation device,etc.

        更多詳細>>

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