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      1. 晶圓級芯片封裝(WLCSP)

        您現在的位置:首頁 > 產品中心 > 晶圓級芯片封裝(WLCSP)

        Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package.  Puya provides WLCSP SPI NOR Flash, IIC EEPROM & VCM Driver products for mobile or portable form facotr applications, such as 3D-CCM, digital cameras , smart watches, GPS navigation devices, etc.


        SPI NOR Flash

        Base on the chip size, Puya develops a series of SPI NOR Flash WLCSP products. All of Puya's  WLCSP products are manufactured and tested in SMIC to ensure the quality and reliability.



        IIC EEPROM

        Puya develops high reliability IIC EEPROM WLCSP products combining unique design and advanced process, while keeps the high performance as packaged  products. 




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